The self-encapsulation kinetics of Ag/Al bilayers were studied both experim
entally and theoretically as part of the effort to introduce Ag as an alter
native metallization scheme for future ultra-large-scale-integrated technol
ogies. Theoretical modeling was based on an analytical solution of a modifi
ed diffusion equation, which incorporated the diffusion of Al atoms through
the Ag layers during the Ag/Al bilayer encapsulation progress. The amount
of segregated Al atoms was monitored by both Rutherford backscattering spec
trometry and film resistivity measurements, and correlated well with the th
eoretical predictions. These findings showed that the kinetics of the self-
encapsulation could be significantly affected by both (i) the chemical affi
nity between Al and Ag atoms, and (ii) the interfacial energy between the m
etal layer (Ag) and the newly formed AlxOyNz diffusion barriers. Higher ann
eal temperatures were shown to accelerate the encapsulation process, and he
nce, achieved a lower resistivity in the underneath Ag layer. This model, i
n addition, confirmed the self-passivating characteristics of AlxOyNz diffu
sion barriers formed by Ag/Al bilayers annealed between 500 and 725 degrees
C. (C) 1999 American Institute of Physics. [S0021-8979(99)07622-7].