An epoxy resin tells its life story. Thermal analysis as a constant companion from development to disposal

Authors
Post, E Kaisersberger, E Knappe, S Emmerich, WD
Citation
E. Post et al., An epoxy resin tells its life story. Thermal analysis as a constant companion from development to disposal, J THERM ANA, 57(1), 1999, pp. 265-273
Citations number
6
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences
Journal title
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
ISSN journal
13886150 → ACNP
Volume
57
Issue
1
Year of publication
1999
Pages
265 - 273
Database
ISI
SICI code
1388-6150(1999)57:1<265:AERTIL>2.0.ZU;2-#
Abstract
With the aid of thermal analysis, epoxy (EP) resins have been characterized from the curing of the components all the way to disposal. The methods emp loyed for the investigations were DSC, TMA, DMA, TG and TG-QMS. The experim ental results obtained will be used here to demonstrate the typical possibi lities offered by these methods for characterization of an epoxy resin from 'cradle to grave'.