Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - effect of crosslinking agents

A simple technique of thermal graft copolymerization of 1-vinyl imidazole ( VIDZ) in the presence of a small amount of a crosslinking agent (XLA) on pl asma-pretreated polyimide (PI or Kapton HN(R)) films with simultaneous lami nation of copper foils was demonstrated. The simultaneous thermal grafting and lamination process was carried out in the temperature range of 80-150 d egrees C under atmospheric conditions and in the complete absence of a poly merization initiator. Significant improvement in adhesion was achieved by t he presence of a XLA, such as 2,4,6-triallyloxy-1,3,5-triazine (TATZ), or 1 ,3,5-triallyl benzene tricarboxylate (TBTC), in VIDZ during the thermal gra ft copolymerization and lamination process. T-peel adhesion strength exceed ing 17 N/cm can be readily achieved for the polyimide-copper interface for grafting and lamination carried out at the reduced temperature of 100 degre es C. The T-peel adhesion strengths are reported as a function of the cooli ng rate, the argon plasma pre-treatment time of the polyimide films, the th ermal lamination temperature, and the thermal lamination time. The polyimid e-copper interface graft copolymerized and laminated in the presence of a X LA also exhibited substantially improved resistance to moisture. The surfac e compositions of the polyimide films and copper foils from the delaminated interfaces were studied by X-ray photoelectron spectroscopy (XPS). The enh anced interfacial adhesion has resulted in cohesive failure deep inside the PI film as is also revealed by the scanning electron micrograph (SEM). (C) 1999 Elsevier Science Ltd. All rights reserved.