A fracture-mechanics model of the microbond test with interface friction

Citation
H. Kessler et al., A fracture-mechanics model of the microbond test with interface friction, COMP SCI T, 59(15), 1999, pp. 2231-2242
Citations number
7
Categorie Soggetti
Material Science & Engineering
Journal title
COMPOSITES SCIENCE AND TECHNOLOGY
ISSN journal
02663538 → ACNP
Volume
59
Issue
15
Year of publication
1999
Pages
2231 - 2242
Database
ISI
SICI code
0266-3538(1999)59:15<2231:AFMOTM>2.0.ZU;2-6
Abstract
The microbond test is commonly used to measure the toughness of fiber/matri x interfaces. However, interfacial friction tends to stabilize the crack an d increase the peak load as compared to a friction-free crack with the same interface toughness. Nevertheless, for a constant friction shear stress bo th the interface toughness and friction stress can be approximately determi ned from load vs. crack length or load vs. displacement hysteresis curves ( including energy dissipation, residual displacement or compliance measureme nts). A friction-free crack is used as a reference solution, and friction i s taken into account in the reduced crack-tip fiber load and debonded fiber elongation. When expressed in terms of these two quantities, the energy re lease rate and fiber end displacement are almost independent of the amount of friction. The approximation involved is verified by a finite-element ana lysis. (C) 1999 Elsevier Science Ltd. All rights reserved.