Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5reinforcements
J. Sigelko et al., Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5reinforcements, J ELEC MAT, 28(11), 1999, pp. 1184-1188
Solidification of eutectic Sn-Ag solder, with and without Cu6Sn5 composite
reinforcements, on copper substrates, was investigated at two different coo
ling rates. The size, orientation, randomness, and overall morphology of th
e dendritic microstructure were examined as a function of cooling rate. Cu6
Sn5 particle reinforcements were found to act as nucleation sites for dendr
ites, in addition to sites on the substrate/solder interface. The mechanica
l properties of these solders were also examined as a function of cooling r
ate. Solder joints with a lower load-carrying area were found to exhibit hi
gher shear strength, but reduced ductility when compared to solder joints w
ith more load carrying area.