Development of conducting adhesive materials for microelectronic applications

Electrically and/or thermally conducting adhesive materials are classified into two categories depending on their conduction modes: isotropic and anis otropic materials. Silver-particle filled epoxy is the most common example of the class of isotropic materials which are conductive in all directions. This material has been long used in the electronic applications as a die-b onding material, where its good thermal conduction rather than its electric al conduction property is utilized. The silver-filled epoxy material has se veral limitations for high performance electrical interconnections, such as low electrical conductivity, increase in contact resistance during thermal exposure, low joint strength, corrosion issue due to silver migration, dif ficulty in rework, and so forth. The anisotropic conducting material provid es electrical and/or thermal conduction only in one direction. An anisotrop ic conducting film (ACF) is used for interconnecting TAB mounted chips to a liquid crystal display panel, where fine pitch interconnection and low tem perature assembly are required. In this paper, a brief review of the state- of-art conducting adhesive technology is provided. Subsequently, developmen t of new conducting adhesive materials is presented for several different a pplications, which include high temperature materials for ceramic substrate s, and low temperature materials for organic substrates.