Cracks were formed along grain boundaries and along deformation bands in th
e interior of a grain in copper bulk bicrystals which had been compressed a
t room temperature, and then annealed in a vacuum at 823 K without unloadin
g. It is considered that the cracks along grain boundaries and deformation
bands were formed by strain induced premelting; when localized regions with
high dislocation density are formed close to grain boundaries or deformati
on bands, the regions may melt at temperatures of approximately 0.5T(M) (T-
M: the melting point in Kelvin). Premelting cracks along deformation bands
were found for the first time in this study. It was found that the developm
ent of premelting cracks was closely related to the duration of the compres
sive load without a large drop during the heating process. Various experime
ntal parameters which affect the formation and development of premelting cr
acks are discussed.