Interfacial reaction layers in SiC/Cu joint friction-bonded with Nb intermediate layer

The influences of the interfacial reaction on the microstructure and bond s trength of the SiC/Cu joint friction-bonded with a Nb intermediate layer ha ve been investigated mainly by TEM observations. It has been found that the reaction at the joint interface proceeded during the heat treatment even a t temperatures below 800 K to form reaction layers similar to 100 nm thick, which caused serious degradation of the joint strength. An attempt is made to thermodynamically explain the evolution of the interfacial microstructu re caused by the reaction during the heat treatment.