Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging

A three-dimensional model is developed to investigate how and conjugate hea t transfer in the microchannel-based heat sink for electronic packaging app lications. The incompressible laminar Navier-Stokes equations of motion are employed as the governing conservation equations which are numerically sol ved using the generalized single-equation framework for solving conjugate p roblems. The theoretical model developed is validated by comparing the pred ictions of the thermal resistance and the friction coefficient with availab le experimental data for a wide range of Reynolds numbers. The detailed tem perature and heat flux distributions as well as the average heat transfer c haracteristics are reported and discussed. The analysis provides a unique f undamental insight into the complex heat flow pattern established in the ch annel due to combined convection-conduction effects in the three-dimensiona l setting. Important practical recommendations are also provided regarding the cooling efficiency of the microchannel heat sinks as well as a possible failure due to the thermal stresses induced by the extremely large tempera ture gradient at the entrance of the channels. (C) 1999 Elsevier Science Lt d. All rights reserved.