Asymptotic analysis of crack interaction with free boundary

Citation
Av. Dyskin et al., Asymptotic analysis of crack interaction with free boundary, INT J SOL S, 37(6), 2000, pp. 857-886
Citations number
47
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
ISSN journal
00207683 → ACNP
Volume
37
Issue
6
Year of publication
2000
Pages
857 - 886
Database
ISI
SICI code
0020-7683(200002)37:6<857:AAOCIW>2.0.ZU;2-V
Abstract
This paper employs the beam and dipole asymptotic techniques for modelling interaction of a crack with parallel free boundaries. Two configurations ar e considered: (1) a crack in a half-plane and (2) a crack in the centre of an infinite strip. Both, the stress intensity factors and the areas of the crack opening are calculated. For the crack situated close to the boundary, the part of the material betw een the crack and the boundary is represented by a beam (plate in plane-str ain). This allows calculating the area of the crack opening. The stress int ensity factors are calculated by matching the beam approximation with Zlati n and Khrapkov's solution (Zlatin and Khrapkov, 1986) for a semi-infinite c rack parallel to the boundary of a half-plane or with Entov and Salganik's solution (Entov and Salganik, 1965) for a central semi-infinite crack in a strip. It has been shown that this asymptotic method allows obtaining two l eading terms for the SIFs and the crack opening area. When the distance between the crack and the free surface is large, the prob lem is treated in the far field approximation. This. dipole asymptotic meth od allows finding the leading asymptotic terms responsible for the crack-bo undary interaction. For intermediate distances between the crack and the boundary, simple inter polating formulas are derived. Particular examples of cracks loaded by pair of concentrated forces and for uniform loading are considered. The obtaine d results are compared with available numerical solutions. (C) 1999 Elsevie r Science Ltd. All rights reserved.