Polarized off-axis Raman spectroscopy: A technique for measuring stress tensors in semiconductors

Citation
Gh. Loechelt et al., Polarized off-axis Raman spectroscopy: A technique for measuring stress tensors in semiconductors, J APPL PHYS, 86(11), 1999, pp. 6164-6180
Citations number
72
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
86
Issue
11
Year of publication
1999
Pages
6164 - 6180
Database
ISI
SICI code
0021-8979(199912)86:11<6164:PORSAT>2.0.ZU;2-P
Abstract
A characterization technique was developed for measuring the complete tenso r nature of stress fields in semiconductors. By combining incident light ti lted away from the normal axis with polarization of the incident and scatte red beams, any Raman-active optical phonon mode can be selectively studied. Once the frequencies and intensities of these phonons are known, the compl ete stress tensor can be determined. Using this concept, a general, systema tic theory and methodology for implementing polarized off-axis Raman spectr oscopy was developed that took into account realistic effects which would b e encountered in an actual experiment. This methodology was applied to mech anically deformed silicon wafers. By applying loads in different configurat ions across the wafer, various types of stress were created including tensi on, compression, and shear. The polarized off-axis Raman technique was vali dated by comparing its results to both analytic calculations based upon the theory of elasticity and to direct measurements of the wafer curvature usi ng a laser deflection method. (C) 1999 American Institute of Physics. [S002 1-8979(99)02922-9].