Infiltration of C/SiC composites with silica sol-gel solutions: Part I. Infiltration by dipping

Citation
M. Aparicio et A. Duran, Infiltration of C/SiC composites with silica sol-gel solutions: Part I. Infiltration by dipping, J MATER RES, 14(11), 1999, pp. 4230-4238
Citations number
34
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
14
Issue
11
Year of publication
1999
Pages
4230 - 4238
Database
ISI
SICI code
0884-2914(199911)14:11<4230:IOCCWS>2.0.ZU;2-B
Abstract
Oxidation resistance of ceramic matrix composites (CMC) of SiC reinforced w ith C fibers (C/SiC) can be improved by filling the residual porosity. The aim of this work was to design and analyze a dipping infiltration process u nder ambient conditions (1 atm pressure and room temperature) with silica s ol-gel solutions prepared from tetraethyl orthosilicate. Different substrat es and solutions have been studied. Thermal treatments. i.e., curing or sin tering between infiltrations, increase the efficiency of the process since the densification of infiltrated silica opens up the remaining porosity. In creasing viscosity and/or concentration of the solution lead to greater wei ght gains. Weight gains are higher in the initial stages of the process bec ause larger diameter porosity remains unfilled. As the process advances, th e average pore size decreases, and only the lower viscosity solution can en ter the residual porosity.