Effect of halogen on the structure of tow temperature polycrystalline silicon thin films fabricated on glass substrates

Citation
T. Kamiya et al., Effect of halogen on the structure of tow temperature polycrystalline silicon thin films fabricated on glass substrates, J CERAM S J, 107(11), 1999, pp. 1099-1104
Citations number
28
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF THE CERAMIC SOCIETY OF JAPAN
ISSN journal
09145400 → ACNP
Volume
107
Issue
11
Year of publication
1999
Pages
1099 - 1104
Database
ISI
SICI code
0914-5400(199911)107:11<1099:EOHOTS>2.0.ZU;2-B
Abstract
Polycrystalline silicon thin films were fabricated by VHF (100-144 MHz) pla sma enhanced chemical vapor deposition, Three different source materials we re used to grow the films on glass substrates: (1) SiH2Cl2/H-2, (2) SiF4/H- 2 and (3) SiH4/H-2 mixing gases. It was found that the gas mixing ratio whe re crystal silicon grows strongly depends on the selection of source gas: i .e,, crystal growth occurred at mixing ratios (SiF4/H-2) smaller than 30/10 seem while the crystal growth in SiH4/H-2 system required much smaller mix ing ratios, such as less than or equal to 1/50 seem, Microstructures of the films were also strongly influenced by the source material, (220) orientat ion structures were easily obtained when SiF4, SiH2Cl2 or B2H6 were used, c ompared to SiH4. In addition, (400) preferentially oriented film grew on gl ass when the film was grown at a gas mixing ratio of SiF4/H-2 = 30/10 seem and a substrate temperature of 200 degrees C, Chlorinated source gases incl uding SiHnClm (n+m=4) are also expected to produce (400) oriented growth.