V. Gaina et al., New semi-interpenetrating polymeric networks from linear polysulfone and thermosetting bismaleimide and polyaminobismaleimide resins, POLYM-PLAST, 38(5), 1999, pp. 927-938
New semi-interpenetrating (semi-IPN) polymeric networks from commercial pol
ysulfone (UDEL RP-1700) and thermosetting bismaleimide (4,4'-bismaleimidodi
phenylmethane) (BMDM) and maleimide terminated polyaminobismaleimide prepol
ymer based upon BMDM and 4,4'-diaminodiphenylmethane were prepared. The che
mistry, processing, physical and mechanical properties, phase morphology, t
hermal stability and solvent resistance of the neat resins are presented. T
he interrelationships among structure, processing, properties, and morpholo
gy are also discussed.