New semi-interpenetrating polymeric networks from linear polysulfone and thermosetting bismaleimide and polyaminobismaleimide resins

Citation
V. Gaina et al., New semi-interpenetrating polymeric networks from linear polysulfone and thermosetting bismaleimide and polyaminobismaleimide resins, POLYM-PLAST, 38(5), 1999, pp. 927-938
Citations number
21
Categorie Soggetti
Material Science & Engineering
Journal title
POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING
ISSN journal
03602559 → ACNP
Volume
38
Issue
5
Year of publication
1999
Pages
927 - 938
Database
ISI
SICI code
0360-2559(1999)38:5<927:NSPNFL>2.0.ZU;2-Z
Abstract
New semi-interpenetrating (semi-IPN) polymeric networks from commercial pol ysulfone (UDEL RP-1700) and thermosetting bismaleimide (4,4'-bismaleimidodi phenylmethane) (BMDM) and maleimide terminated polyaminobismaleimide prepol ymer based upon BMDM and 4,4'-diaminodiphenylmethane were prepared. The che mistry, processing, physical and mechanical properties, phase morphology, t hermal stability and solvent resistance of the neat resins are presented. T he interrelationships among structure, processing, properties, and morpholo gy are also discussed.