Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

Authors
Zuruzi, AS Chiu, CH Chen, WT Lahiri, SK Tu, KN
Citation
As. Zuruzi et al., Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow, APPL PHYS L, 75(23), 1999, pp. 3635-3637
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
75
Issue
23
Year of publication
1999
Pages
3635 - 3637
Database
ISI
SICI code
0003-6951(199912)75:23<3635:IOH(SI>2.0.ZU;2-L
Abstract
We carried out experiments and numerical simulations to investigate the tra nsport of Sn in a composite solder joint, comprising of high-Pb and high-Sn (SnPb) alloys, in a chip-composite solder-organic substrate package during the reflow process. Both the experimental and simulation results demonstra te that surface diffusion causes the transport of Sn on the surface to be f aster than that inside the solder joint. Surface diffusion also accelerates the homogenization process of the composite solder joint. (C) 1999 America n Institute of Physics. [S0003-6951(99)00449-0].