Cure behavior and thermal degradation mechanisms of epoxy and epoxy-cyanate resins

Citation
N. Regnier et al., Cure behavior and thermal degradation mechanisms of epoxy and epoxy-cyanate resins, POLYM ADV T, 10(11), 1999, pp. 637-646
Citations number
15
Categorie Soggetti
Organic Chemistry/Polymer Science
Journal title
POLYMERS FOR ADVANCED TECHNOLOGIES
ISSN journal
10427147 → ACNP
Volume
10
Issue
11
Year of publication
1999
Pages
637 - 646
Database
ISI
SICI code
1042-7147(199911)10:11<637:CBATDM>2.0.ZU;2-9
Abstract
The cure reactions of tetraglycidyl methylene diamine (TGMDA) epoxy cured w ith tetrasubstituted aromatic diamine on one hand and diglycidyl ether of b isphenol A and diglycicyl ether tetrabromobisphenol A epoxies cured with me thylene bis (phenyl-4-cyanate) on the other hand are reported. Systematic F ourier transform infrared (FTIR) spectroscopy studies of the cure reaction of epoxy and epoxy-cyanate during thermal cycles are presented. FTIR studie s indicate that the reaction of TGMDA monomer is total but the network cont ains a large amount of primary amine. The cyanate monomer reacts rapidly to form triazine structures. Then the epoxy monomers homopolymerize and cross link with free cyanate groups. The gas chromatography/mass spectrometry stu dy of volatile products evolved during the polymer thermal degradation show s the dehydration of the epoxy network and the decomposition of the amine s tructure. The FTIR and solid-phase C-13 nuclear magnetic resonance analysis revealed that the ether functions and the amine groups are temperature sen sitive but the triazine structure is not. Copyright (C) 1999 John Wiley & S ons, Ltd.