In this paper a new measurement technique for the characterization of therm
al properties of single or multilayer thin film membranes is presented. The
measurement technique is based on the combined usage of polysilicon (PS) h
eating resistors and polysilicon-aluminum thermocouples used as thermal sen
sors. To demonstrate its effectiveness this test structure is used to inves
tigate the thermal conductivity and diffusivity of different materials depo
sited as thin films. Previously measured low stress LPCVD SiN is used as a
mechanical support and PS as well as PECVD SiO thin films are deposited on
it and then characterized. DC, pulsed and harmonic investigation are perfor
med and the experimental results obtained are, where comparison has been po
ssible, in good agreement with previously published data. (C) 1999 Elsevier
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