The nano-indentation method has been developed to evaluate the mechanical p
roperties of metal films. In this study an indentation loading curve is emp
loyed to determine the yield strength and hardening index of an Al film on
a Si substrate. The result is compared with that measured by a uniaxial ten
sile test with an Al film deposited on an Al foil. The yield strength of th
e Al film can be determined according to the testing results of this compou
nd material and it agrees reasonably with that evaluated by the nano-indent
ation method. In addition, X-ray diffraction measurements of the four point
bending specimen is used to measure the stress-strain curve of Cu films on
steel substrate. The samples are prepared by ion beam enhanced deposition
and magnetron-sputtering deposition. The results show that the strength of
Cu film depends on the deposition technology and is much higher than that o
f the bulk material. (C) 1999 Elsevier Science S.A. All rights reserved.