Fiber-array pigtailing and packaging of an InP-based optical cross-connectchip

Authors
van Zantvoort, JHC Huijskens, FM Herben, CGP de Waardt, H
Citation
Jhc. Van Zantvoort et al., Fiber-array pigtailing and packaging of an InP-based optical cross-connectchip, IEEE S T QU, 5(5), 1999, pp. 1255-1259
Citations number
1
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
ISSN journal
1077260X → ACNP
Volume
5
Issue
5
Year of publication
1999
Pages
1255 - 1259
Database
ISI
SICI code
1077-260X(199909/10)5:5<1255:FPAPOA>2.0.ZU;2-G
Abstract
A method of coupling six single-mode fiber tapers with 250-mu m spacing to an InP-based integrated optical cross-connect chip has been developed and r ealized. The complete pigtailed chip assembly is packaged while chip temper ature can be controlled, The device is successful tested at an ambient temp erature range of 5 degrees C to 45 degrees C.