Kinetics of electroless Ni-P-B alloy deposition

Citation
Ss. Abd El-rehim et al., Kinetics of electroless Ni-P-B alloy deposition, PLAT SURF F, 86(12), 1999, pp. 94-98
Citations number
17
Categorie Soggetti
Metallurgy
Journal title
PLATING AND SURFACE FINISHING
ISSN journal
03603164 → ACNP
Volume
86
Issue
12
Year of publication
1999
Pages
94 - 98
Database
ISI
SICI code
0360-3164(199912)86:12<94:KOENAD>2.0.ZU;2-N
Abstract
Using kinetics data, an empirical deposition rate was derived for electrole ss deposition of ternary alloys nickel-phosphorus-boron on pretreated alumi num substrate: r = 463.33 (H2PO2)(0.46) (BH4)(0.3) (HCOOH)(0.35) (H+)(0.15) exp (18.15[T-353]/T) where r is the rate of deposition (mg/cm(2)/hr) and T is the absolute temperature, from baths containing nickel ions, hypophosph ite ions, borohydride ions and formic acid, This equation can be applied on ly in limited ranges of concentration of the bath components at 80 degrees C. The correlation coefficient between the experimental plating rates and t hose computed using the developed empirical rate equation is 96 percent.