Tm. Klein et al., Evidence of aluminum silicate formation during chemical vapor deposition of amorphous Al2O3 thin films on Si(100), APPL PHYS L, 75(25), 1999, pp. 4001-4003
Using narrow nuclear reaction resonance profiling, aluminum profiles are ob
tained in similar to 3.5 nm Al2O3 films deposited by low temperature (< 400
degrees C) chemical vapor deposition on Si(100). Narrow nuclear resonance
and Auger depth profiles show similar Al profiles for thicker (similar to 1
8 nm) films. The Al profile obtained on the thin film is consistent with a
thin aluminum silicate layer, consisting of Al-O-Si bond units, between the
silicon and Al2O3 layer. Transmission electron microscopy shows evidence f
or a two-layer structure in Si/Al2O3/Al stacks, and x-ray photoelectron spe
ctroscopy shows a peak in the Si 2p region near 102 eV, consistent with Al-
O-Si units. The silicate layer is speculated to result from reactions betwe
en silicon and hydroxyl groups formed on the surface during oxidation of th
e adsorbed precursor. (C) 1999 American Institute of Physics. [S0003-6951(9
9)03451-8].