ELECTRICAL-PROPERTIES OF SILICA-POLYIMIDE COMPOSITE DIELECTRIC THIN-FILMS PREPARED VIA SOL-GEL REACTION AND THERMAL IMIDIZATION

Thin dielectric films composed of silica and polyimide were prepared f rom tetraethoxysilane (TEOS) and precursor of poly(p-phenylene bipheny ltetracarboximide)(BPDA-PDA). Silica particles were generated from TEO S via sol-gel process. BPDA-PDA polyimide was prepared from its flexib le and soluble precursors, poly(p-phenylene biphenyltetracarboxamic ac id)(BPDA-PDA PAA), and poly(p-phenylene biphenyltetracarboxamic diethy l ester)(BPDA-PDA ES), through thermal imidization process. In the pre sent work, the electrical properties of the silica-polyimide hybrid co mposite films were examined utilizing a capacitance measurement by a h igh resolution electrometer/function generator system. The effects of TEOS contents and precursor types for polyimide matrix of the composit es on the relative dielectric constant, dielectric dissipation factor, and resistivity of the composite films were investigated.