Compatibility of the low-dielectric-constant poly(arylether) with the electroless copper deposition solution

Possible interactions between nonfluorinated poly(arylether) thin films and the recently developed electroless Cu deposition solution are investigated . The results show that there is no chemical reaction between this low-diel ectric-constant polymer and the electroless Cu deposition solution. However , a significant change in thickness as well as refractive index is induced by the electroless solution conditions. It is demonstrated that higher temp eratures can alleviate the electroless Cu solution-induced effects as far a s the glass transition temperature, the coefficient of thermal expansion, a nd refractive index are concerned. (C) 1999 The Electrochemical Society. S0 013-4651(98)08-032-X. All rights reserved.