We demonstrate the application of real-time film-stress monitoring and cont
rol using a multi-beam optical sensor. In situ measurements on wide-bandgap
boron nitride films grown by ECR-assisted sputtering reveal a critical str
ess beyond which defects are injected into the silicon substrate. This is m
arked by a rapid onset of wafer curvature. The method should be particularl
y useful for monitoring stress build-up in other wide-bandgap nitride films
where no appropriate lattice-matched substrates are presently available. (
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