The use of slow positron beams to study damage resulting from the ion impla
ntation of GaAs is described in detail. The measurement of damage resulting
from 125 keV Si+ is used as an example to demonstrate the sensitivity of t
he technique to implant fluences of < 1 x 10(11) cm(-2). A method for extra
cting defect profiles is also described and it is shown that for the curren
t measurements a defect tail extends into the sample, probably resulting fr
om ion channelling. Specific uses of the positron technique relevant to GaA
s device fabrication are given. (C) 1999 Elsevier Science S.A. All rights r
eserved.