The use of MOCVD grown n(+)-InxGa1 - xAs capping layer to produce a non-all
oyed ohmic contact to GaAs-based devices is discussed. Very low specific co
ntact resistance of 10(-7) Omega cm(2) was measured using conventional Ni/A
uGe/Ni/Au metal contact system. A theoretical model for tunnelling through
metal-semiconductor barriers using the WKB approximation was developed whic
h indicates a good agreement with experimental data. HBTs fabricate using t
hese InGaAs capping layers demonstrated very low emitter series resistance,
up to four times smaller compared to similar HBT structures using GaAs cap
ping layers. (C) 1999 Elsevier Science S.A. All rights reserved.