E. Beltowskalehman et E. Chassaing, ELECTROCHEMICAL INVESTIGATION OF THE NI-CU-MO ELECTRODEPOSITION SYSTEM, Journal of Applied Electrochemistry, 27(5), 1997, pp. 568-572
The kinetics of Ni-Cu-Mo alloy deposition has been investigated by mea
ns of steady-state polarization measurements. Strong interactions betw
een the three discharging metals occur: nickel induces molybdenum depo
sition but its discharge is markedly inhibited by molybdenum. Copper d
eposition has a depolarizing effect on Ni-Mo discharge. Hydrogen evolu
tion is associated with molybdenum deposition. The electrocrystallizat
ion process is dominated by the Ni-Mo codischarge kinetics.