The separation of generation lifetimes of Si and SiGe using capacitance-transient measurements on MOS capacitors formed by plasma anodisation of Si :Si0.9Ge0.1 : Si substrates
Ls. Riley et al., The separation of generation lifetimes of Si and SiGe using capacitance-transient measurements on MOS capacitors formed by plasma anodisation of Si :Si0.9Ge0.1 : Si substrates, SOL ST ELEC, 43(12), 1999, pp. 2247-2250
A simple technique leading to the measurement of minority carrier lifetimes
of UHV compatible LPCVD Si and SiGe by C-t depth profiling of Metal:Oxide:
Si:SiGe:Si structures is reported. A high quality gate oxide is realised by
low temperature (< 100 degrees C) plasma anodisation thereby reducing any
oxidation effects on the underlying epitaxial layer quality, Capacitance re
sponse times were observed for an impurity concentration of similar to 2.5
x 10(17) cm(-3), giving rise to generation lifetimes of the Si and Si0.9Ge0
.1 of >0.55 and 2.6 mu s respectively, reflective of very high quality epit
axial semiconductor material. (C) 1999 Elsevier Science Ltd. All rights res
erved.