Formation of Ni microstructure with high aspect ratio without thicker photo
resist was tried by an electrodeposition method. The Ni microprobes thicker
than photoresist thickness were electrodeposited on a patterned substrate
using thin photoresist patterned with UV radiation. It was-important for pr
eparing Ni microprobe with high aspect ratio to keep the overpotential of p
atterned cathode higher, and moreover the agitation using a paddle plating
cell system was so effective to form uniform microprobes.