A novel high-fidelity pattern transfer and microfabrication method using a
scanning micro-/ nanonozzle is presented. Reactive species created in a dow
nstream plasma source are transported through a capillary which is pulled t
o form a nozzle. Due to the high directionality of the emerging particle be
am, a strongly localized etching or deposition is induced. By scanning the
sample a small distance under the nozzle a pattern transfer is performed. F
undamental principles of this technology, such as transport of free radical
s through high aspect ratio capillaries, localized etching, and high etchin
g rates without ion bombardment, are demonstrated in this work. The achieve
d etching rates are up to 1.1 mu m per minute in silicon. Combining the mic
roplasma source with scanning probe techniques provides an instrument for s
imultaneous in situ structuring and imaging. (C) 1999 American Vacuum Socie
ty. [S0734-211X(99)20106-0].