In the semiconductor industry, the inspection technique using an electron b
eam is expected to play an important role because of its high spatial resol
ution. In comparison with conventional scanning techniques, direct imaging
produced by projection optics offers both faster mapping rates due to paral
lel detection and higher resolution. An electron microscope based on the pr
ojection imaging optics has been designed and constructed. Secondary electr
ons emitted by the area exposure are projected through the projection optic
s consisting of fully electrostatic lenses, and then imaged onto the image
detection system. A computational analysis indicates resolution of 0.27 mu
m which can satisfy both adequate resolution and image grab time. An image
of a 0.2 mu m design rule device is demonstrated. (C) 1999 American Vacuum
Society. [S0734-211X(99)05706-6].