Field size versus column shortness in high throughput electron beam lithography

Citation
L. Han et al., Field size versus column shortness in high throughput electron beam lithography, J VAC SCI B, 17(6), 1999, pp. 2830-2835
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
17
Issue
6
Year of publication
1999
Pages
2830 - 2835
Database
ISI
SICI code
1071-1023(199911/12)17:6<2830:FSVCSI>2.0.ZU;2-R
Abstract
In electron beam projection systems there are competing requirements for co lumn length. Shorter lengths lead to reduced space charge interactions whil e Longer columns allow larger field sizes. Other parameters include the con vergence angle and beam voltage. We have used a generic 4:1 reduction telec entric system as a test vehicle to study these tradeoffs. To determine the lens aberrations we employed a thick lens configuration with constant magne tic fields; space charge blur was estimated with a Monte Carlo simulation u sing a thin lens approximation. For a given beam voltage V, held size F, co nvergence angle alpha, and current I, there is a maximum value of column le ngth L that satisfies a given resolution requirement. For example, if V=100 kV and 1=20 mu A then L must be less than 30 cm for 100 nm resolution. The use of a retarding field just upstream of the target can lead to greatly i mproved performance in terms of resolution, field size, and throughput; e.g ., the minimum resolved feature size is approximately proportional to the r atio of landing voltage over beam voltage. (C) 1999 American Vacuum Society . [S0734-211X(99)09406-8].