Projection reduction exposure with variable axis immersion lenses (PREVAIL)
represents the high throughput e-beam projection approach to NGL, which IB
M is pursuing in cooperation with Nikon as alliance partner; another e-beam
projection approach is SCALPEL pursued by Lucent Technologies. This articl
e discusses the challenges and accomplishments of the PREVAIL project. It w
ill focus on the results obtained with the proof of concept (POC) system. T
his system was developed to demonstrate key technical building blocks requi
red for high throughput, high resolution e-beam step, and scan projection l
ithography. The supreme challenge facing all e-beam lithography approaches
has been and still is throughput. Since the throughput of e-beam projection
systems is severely limited by the available optical field size, the key t
o success is the ability to overcome this limitation. The PREVAIL technique
overcomes field-limiting off-axis aberrations through the use of variable
axis lenses, which electronically shift the optical axis simultaneously wit
h the deflected beam, so that the beam effectively remains on axis. This te
chnique developed by IBM has been successfully applied to probe-forming sha
ped beam systems (EL-4). It had to be modified and extended to provide the
larger beam deflections and the wider beam images at the wafer plane used i
n projection reduction systems. The POC system projects sequentially 1 x 1
mm(2) subfields, selected at the reticle, in 4:1 reduction mode onto the wa
fer, exposing and resolving patterns of 80 nm lines and spaces in resist; e
ach sub field contains 10(7) pixels. The deflection capability demonstrated
permits electronic selection of 20 1 mm subfields at the reticle and proje
ction of these 20 subfields onto the wafer exposing a field with 5 mm scan
length. The resist images provide proof that PREVAIL effectively eliminates
off-axis aberrations affecting resolution, since the deflected and undefle
cted images are indistinguishable. PREVAIL also controls off-axis aberratio
ns affecting placement accuracy of pixels, since distortions of the deflect
ed subfield are corrected to within 12 nm. A high emittance gun has been de
veloped to provide uniform illumination of the patterned subfield, and to f
ill the large numerical aperture of the projection optics required to signi
ficantly reduce beam blur caused by Coulomb interaction. (C) 1999 American
Vacuum Society. [S0734-211X(99)03806-8].