B. Lu et al., Study of acid diffusion in a positive tone chemically amplified resist using an on-wafer imaging technique, J VAC SCI B, 17(6), 1999, pp. 3345-3350
In this article, the acid diffusion coefficient of Shipley positive tone re
sist, UV-III, in an as-spin coated film is determined by using an on-wafer
imaging technique. This technique involves incorporation of a pH-dependent
fluorescence material, 5-aminofluorescence, into the resist. This fluoresce
nce material images the acid distribution by generating fluorescence intens
ity contrast under a confocal microscope. Using a laser beam of 488 nm wave
length and an objective lens of 100X (with oil immersion), the nominal feat
ure sizes of 0.20 mu m can be resolved with a high signal-to-noise ratio. T
he acid diffusion coefficient is determined from 1 mu m lines and spaces (1
:9), which are generated by e-beam writing under different post exposure ba
king (PEB) times. The value obtained during the PEB is smaller than 3.5X10(
-13) cm(2)/s. The resist properties (e.g., sensitivity, resolution, and the
rmal stability) are not changed significantly by the low loading of the flu
orophore because the dose to size and the printed linewidth are very close
to the conditions for resist processing without the fluorophore. (C) 1999 A
merican Vacuum Society. [S0734-211X(99)14106-4].