Comparison of the lithographic properties of positive resists upon exposure to deep- and extreme-ultraviolet radiation

Citation
Rl. Brainard et al., Comparison of the lithographic properties of positive resists upon exposure to deep- and extreme-ultraviolet radiation, J VAC SCI B, 17(6), 1999, pp. 3384-3389
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
17
Issue
6
Year of publication
1999
Pages
3384 - 3389
Database
ISI
SICI code
1071-1023(199911/12)17:6<3384:COTLPO>2.0.ZU;2-M
Abstract
Nineteen chemically amplified ultrathin resists were imaged using exposure to extreme-ultraviolet (EUV) (13.4 nm) and deep-ultraviolet (DUV) (248 nm) radiation. Direct comparisons were made of photospeed, resolution, and line edge roughness (LER). The photospeed of these resists at 248 nm shows a go od correlation with photospeed at EUV for three polymer types, but appears independent of photoacid generator type. This result underscores the import ance of the polymer in photoacid generation at EUV. Resolution showed poor correlation between DUV and EW. Correlations were made between the line edg e roughness of EW-imaged features and unexposed film thickness loss, resist contrast, image log slope (ILS), and LER of resists exposed at DUV. Both c ontrast and image log slope play important roles in defining LER performanc e-where the best LER is achieved at high contrast and high ILS. (C) 1999 Am erican Vacuum Society. [S0734-211X(99)20306-X].