We report on hot electron stress measurements on 0.14 mu m MOCVD grown AlIA
s/GaIn/InP HEMTs. The stress measurements increase the drain-source current
and hence induce a temporary negative shift in the threshold voltage in un
passivated HEMTs. A permanent negative shift in the threshold voltage has b
een obtained in passivated HEMTs, The observed degradation (temporary/perma
nent) is due to the storage of positive charges (created by the impact ioni
zation in the channel) in the Schottky AlInAs layer (temporary) or at the i
nterface of semiconductor-passivation layer (permanent). For a given drain-
source bias, a shift in the threshold voltage is larger in the gate-source
bias region where the device has a maximum transconductance value. (C) 1999
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