Early electromigration effects and early resistance changes

Authors
Scorzoni, A De Munari, I Impronta, M Kelaidis, N
Citation
A. Scorzoni et al., Early electromigration effects and early resistance changes, MICROEL REL, 39(11), 1999, pp. 1647-1656
Citations number
26
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
39
Issue
11
Year of publication
1999
Pages
1647 - 1656
Database
ISI
SICI code
0026-2714(199911)39:11<1647:EEEAER>2.0.ZU;2-6
Abstract
This paper reviews different known physical phenomena acting during electro migration, such as changes in the mechanical stress of the metal line, void growth and precipitation/dissolution of alloy elements (Cu, Si) and their effects on early resistance changes. The superposition of all these phenome na is also discussed to describe the typical early resistance changes detec ted in Al-Cu lines of the present technology. (C) 1999 Elsevier Science Ltd . All rights reserved.