Thermal effects on urea-copper binding within a supramolecular assembly

Authors
Purakayastha, A Baruah, JB
Citation
A. Purakayastha et Jb. Baruah, Thermal effects on urea-copper binding within a supramolecular assembly, NEW J CHEM, 23(12), 1999, pp. 1141-1142
Citations number
21
Categorie Soggetti
Chemistry
Journal title
NEW JOURNAL OF CHEMISTRY
ISSN journal
11440546 → ACNP
Volume
23
Issue
12
Year of publication
1999
Pages
1141 - 1142
Database
ISI
SICI code
1144-0546(199912)23:12<1141:TEOUBW>2.0.ZU;2-V
Abstract
Copper(II) ions can be embedded in the channels of urea to give complexes w ith thermal sensing properties.