Typical measurements on n-channel MOSFETs show that interface damage, causi
ng threshold and transconductance shifts, tends to peak when V-GS approxima
te to 0.5V(DS). In such conditions, more impact ionization (substrate curre
nt) is measured. At higher gate voltage, one expects that channel hot elect
rons would impact the interface at increased energy and numbers. Therefore,
it has normally been assumed that hot carriers in the channel cannot direc
tly contribute to damage, and impact-generated holes must be injected into
the oxide for damage to take place. However, there is increasing experiment
al evidence that hot electrons should be able to remove hydrogen atoms whic
h passivate interface dangling bonds, even through a multiple collision pro
cess, at energies below oxide-injection threshold (typically 3.0 eV). A det
ailed full-band Monte Carlo analysis shows that in a typical 0.25 mu m gate
device there are, indeed, more energetic electrons hitting the surface whe
n V-GS, = V-DS than at the condition of maximum impact damage V-GS approxim
ate to 0.5V(DS). However, the electrons impact the surface at much shallowe
r angles, with lower chance of perpendicular momentum transfer to the inter
face. This analysis reconciles damage measurements with the physical pictur
e suggesting direct damage generation by energetic electrons. (C) 1999 Else
vier Science B.V. All rights reserved.