A case study: A printed circuit assembly with a no-lead solder assembly process

Authors
Trumble, W
Citation
W. Trumble, A case study: A printed circuit assembly with a no-lead solder assembly process, GREEN ELECTRONICS GREEN BOTTOM LINE, 2000, pp. 305-310
Categorie Soggetti
Current Book Contents
Journal title
GREEN ELECTRONICS GREEN BOTTOM LINE → ACNP
Year of publication
2000
Pages
305 - 310
Database
ISI
SICI code