Electrical and thermal properties of Tb0.3Dy0.7Fe2-x

Citation
Ba. Cook et al., Electrical and thermal properties of Tb0.3Dy0.7Fe2-x, J APPL PHYS, 87(2), 2000, pp. 776-780
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
87
Issue
2
Year of publication
2000
Pages
776 - 780
Database
ISI
SICI code
0021-8979(20000115)87:2<776:EATPOT>2.0.ZU;2-K
Abstract
Samples of Tb0.3Dy0.7Fe2-x where x=0.05-0.10 (TERFENOL-D) were characterize d for electrical resistivity and thermal diffusivity between room temperatu re and the Curie temperature, which for this composition is 360 degrees C. Additionally, the thermal diffusivity of one of the samples was measured to 1000 degrees C. Measurements were performed on two different orientations of standard, production-grade, grain-oriented TERFENOL-D produced by a Brid gman growth technique at ETREMA Products, Inc. The orientations were parall el and normal to the < 112 > crystallographic direction. The electrical res istivity and thermal diffusivity both exhibited isotropic behavior over the temperature range studied. The electrical resistivity of all samples incre ased monotonically from 0.06 m Omega-cm at room temperature to 0.14 m Omega cm at 360 degrees C, consistent with behavior expected for normal metals. The thermal conductivity was found to decrease with temperature from 135 mW /cm degrees C at room temperature to 122 mW/cm degrees C at 360 degrees C. The thermal diffusivity was found to exhibit a sharp cusp in the vicinity o f the Curie temperature, T-C, increasing with temperature for T > T-C. Appl ication of the Wiedemann-Franz law indicates that over 86% of the heat is c arried by electrons. (C) 2000 American Institute of Physics. [S0021-8979(00 )02602-5].