Study of the dielectric constant of polyurethane/polybutyl-methacrylate interpenetrating polymer networks using metal-insulator-semiconductor structure
Xm. Qian et al., Study of the dielectric constant of polyurethane/polybutyl-methacrylate interpenetrating polymer networks using metal-insulator-semiconductor structure, J APPL POLY, 75(5), 2000, pp. 721-727
Polyurethane/polybutyl-methacrylate interpenetrating polymer networks (IPNs
) film was formed on n-Si substrate by the dropping technique. When aluminu
m (Al) was vacuum deposited on the top of the film, the Al/IPNs/n-Si (metal
-insulator-semiconductor) structure was fabricated successfully. With the a
id of the high-frequency capacitance-voltage (C-V) characteristics at room
temperature, the dielectric constant of IPNs was obtained. In the C-V curve
s, an increased hysteresis at high sweep voltage and a plateau in the deple
tion region were observed. This plateau indicates that the unsaturated bond
s beyond IPNs film could act as electron well at the applied voltage above
10 V. (C) 2000 John Wiley & Sons, Inc.