Study of the dielectric constant of polyurethane/polybutyl-methacrylate interpenetrating polymer networks using metal-insulator-semiconductor structure

Citation
Xm. Qian et al., Study of the dielectric constant of polyurethane/polybutyl-methacrylate interpenetrating polymer networks using metal-insulator-semiconductor structure, J APPL POLY, 75(5), 2000, pp. 721-727
Citations number
26
Categorie Soggetti
Organic Chemistry/Polymer Science","Material Science & Engineering
Journal title
JOURNAL OF APPLIED POLYMER SCIENCE
ISSN journal
00218995 → ACNP
Volume
75
Issue
5
Year of publication
2000
Pages
721 - 727
Database
ISI
SICI code
0021-8995(20000131)75:5<721:SOTDCO>2.0.ZU;2-K
Abstract
Polyurethane/polybutyl-methacrylate interpenetrating polymer networks (IPNs ) film was formed on n-Si substrate by the dropping technique. When aluminu m (Al) was vacuum deposited on the top of the film, the Al/IPNs/n-Si (metal -insulator-semiconductor) structure was fabricated successfully. With the a id of the high-frequency capacitance-voltage (C-V) characteristics at room temperature, the dielectric constant of IPNs was obtained. In the C-V curve s, an increased hysteresis at high sweep voltage and a plateau in the deple tion region were observed. This plateau indicates that the unsaturated bond s beyond IPNs film could act as electron well at the applied voltage above 10 V. (C) 2000 John Wiley & Sons, Inc.