Titanium nitride thin films were deposited on monocrystalline silicon (mc-S
i) substrates by direct current reactive magnetron sputtering. Auger electr
on spectra (AES) of deposited films at different nitrogen partial pressures
, show the typical N KL23L23 and Ti L3M23M23 Auger transition overlapping.
Also, changes in the Ti L3M23M45 Auger transition peak are observed. X-ray
diffraction and high resolution electron microscopy (HRTEM) of a golden col
or TiN/mc-Si sample, reveal a preferential polycrystalline columnar growth
in the [111] orientation. This sample was also analyzed by electron energy-
loss spectroscopy (EELS). The N/Ti elemental ratio is slightly different to
the value determined by AES. Atomic distribution around the N atoms is in
agreement with that expected from the N atom in the fee unit cell of TiN. T
his distribution was obtained via an extended energy-loss fine structure (E
XELFS) analysis from EELS spectra. (C) 1999 Elsevier Science B.V. All right
s reserved.