Wf. Gale et Zam. Abdo, Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system, MET MAT T A, 30(12), 1999, pp. 3111-3124
Transient liquid-phase (TLP) bonds between dissimilar materials can have co
mplex microstructures that evolve both during holding at the bonding temper
ature and on cooling. In this article, an examination is made of the feasib
ility of producing bulk-alloy microstructural analogues for individual micr
ostructural features of dissimilar material TLP bonds. The ultimate intent
of this work is to enable the contribution of individual microstructural fe
atures to the overall properties of TLP bonds to be determined. Specificall
y, the article focuses on the production, characterization, and application
s of microstructural analogues for TLP bonds in an NiAl/Cu/Ni model system.
The article examines the use of five different cast Ni-Al-Cu alloys, toget
her with heat treatment of selected materials, as bulk analogues for six di
stinct microstructural regions of the NiAl/Cu/Ni bonds. Each of these analo
gues is characterized in detail by transmission electron microscopy (TEM) a
nd compared to the relevant target region of the bond. An initial examinati
on is also made of the use of bulk alloys in aiding an understanding of pha
se transformations and structure-property relationships in these bonds.