The amount of strain was measured in GaN films using X-ray diffraction, Ram
an, and curvature techniques as a function of film thickness and the Si dop
ing concentration. It was found that for a doping concentration of 2 x 10(1
9), the threshold thickness for crack formation was about 2.5 mu m. Transmi
ssion electron microscopy observations showed that cracking proceeds withou
t plastic deformation (i.e., no dislocation motion), and occurs catastrophi
cally along the low-energy {1 (1) under bar 0 0} cleavage plane of GaN. (C)
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