Dopant atoms segregate to SiO2/Si(001) interfaces. This causes problems dur
ing manufacture of submicron microelectronic devices. On the basis of ab in
itio calculations, we identify the mechanisms by which P atoms are bonded a
nd deactivated under the interface. We argue that P segregation occurs by (
1) trapping at interfacial dangling bonds, (2) trapping at vacancies and va
cancy-oxygen complexes bound under the interface, and (3) formation of pair
s of threefold-coordinated P atoms. The first mechanism is important at low
dopant concentrations and when no vacancies are available, the second one
dominates at medium dopant concentrations after P implantation, the third o
ne controls the segregation at dopant concentrations around 10(19) cm(-3) o
r higher. (C) 1999 Elsevier Science B.V. All rights reserved.