Electronic transport properties of polycrystalline silicon films depositedon ceramic substrates

Citation
S. Bourdais et al., Electronic transport properties of polycrystalline silicon films depositedon ceramic substrates, PHYSICA B, 274, 1999, pp. 544-548
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA B
ISSN journal
09214526 → ACNP
Volume
274
Year of publication
1999
Pages
544 - 548
Database
ISI
SICI code
0921-4526(199912)274:<544:ETPOPS>2.0.ZU;2-M
Abstract
In this paper we first present our results on growth of silicon onto silico n oxide and ceramic (alumina, mullite) substrates in three chemical vapor d eposition (CVD) reactors using chlorosilanes as precursor gases. The effect of operational parameters (substrate temperature and gas concentration) on growth rate and grain size were analyzed using scanning electron microscop y (SEM) technique. We show that deposition rates up to 5 mu m/min can be re ached. Furthermore, preferential(up to 80%) (220) oriented structure with g rain size ranging from 0.5 to 10 mu m can be generated for a 10 mu m thick Si film. In the second part we report on electronic properties of the depos ited poly-Si films through the layer resistivity, open-circuit voltage of p hotovoltaic devices, minority carrier diffusion length and spectral respons e data. We show that the grain size and the post-hydrogenation treatment af fect mostly the open-circuit voltage and weakly the spectral response. (C) 1999 Elsevier Science B.V. All rights reserved.