Effects of nitrogen on dislocations in silicon during heat treatment

Citation
Ds. Li et al., Effects of nitrogen on dislocations in silicon during heat treatment, PHYSICA B, 274, 1999, pp. 553-556
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA B
ISSN journal
09214526 → ACNP
Volume
274
Year of publication
1999
Pages
553 - 556
Database
ISI
SICI code
0921-4526(199912)274:<553:EONODI>2.0.ZU;2-5
Abstract
By indentation at room temperature followed by annealing at high temperatur es, the pinning effect of nitrogen on dislocations in nitrogen-doped Czochr alski silicon (NCZ Silicon) has been studied. Experimental results showed t hat dislocations in NCZ Silicon moved slower and shorter than those in comm on Czochralski silicon (CZ Silicon) during the annealing. The results also indicated that the activation energy of the dislocations in NCZ Silicon was higher than that in CZ Silicon. The stress relaxing mechanism is discussed . (C) 1999 Elsevier Science B.V. All rights reserved.