By indentation at room temperature followed by annealing at high temperatur
es, the pinning effect of nitrogen on dislocations in nitrogen-doped Czochr
alski silicon (NCZ Silicon) has been studied. Experimental results showed t
hat dislocations in NCZ Silicon moved slower and shorter than those in comm
on Czochralski silicon (CZ Silicon) during the annealing. The results also
indicated that the activation energy of the dislocations in NCZ Silicon was
higher than that in CZ Silicon. The stress relaxing mechanism is discussed
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