Metal-semiconductor contacts are used to examine deep electronic states nea
r the (In,Ga)P surface by deep-level transient Fourier spectroscopy. Toward
s the as-grown (In,Ga)P surface, the In mole fraction increases due to para
sitic indium deposited from the horizontal reactor during cooling after gro
wth. This process is accompanied by compressive strain, which leads to the
formation of several deep-level defects near the surface of Si- as well as
Zn-doped (In,Ga)P layers and their successive diffusion into the epitaxial
layer. In contrast, Si-doped (In,Ga)P capped by a GaAs layer is practically
free of deep-level defects. In the bulk of Zn-doped layers, a dominant hol
e trap is found at 0.91 eV with or without a GaAs cap layer. (C) 1999 Elsev
ier Science B.V. All rights reserved.