Optimal temperature profiles for minimum residual stress in the cure process of polymer composites

Citation
Ak. Gopal et al., Optimal temperature profiles for minimum residual stress in the cure process of polymer composites, COMP STRUCT, 48(1-3), 2000, pp. 99-106
Citations number
18
Categorie Soggetti
Material Science & Engineering
Journal title
COMPOSITE STRUCTURES
ISSN journal
02638223 → ACNP
Volume
48
Issue
1-3
Year of publication
2000
Pages
99 - 106
Database
ISI
SICI code
0263-8223(200001/03)48:1-3<99:OTPFMR>2.0.ZU;2-B
Abstract
Manufacturing of polymer composites using a curing process requires the spe cification of the temperature as a function of time, i.e., the temperature profile. It is of utmost importance that the selected profile satisfies a n umber of criteria which include the minimum residual stresses, minimum cure cycle lime and full degree of cure. The development of residual stresses d uring the cure cycle is one of the most important problems as they affect t he strength and the mechanical properties of the final product adversely. T he object of the present study is to determine the optimal temperature prof iles used during curing in order to minimise these stresses. Numerical simu lation is used to study the development of stresses during curing based on a process model which includes the effects of chemical and thermal strains and the viscoelastic material behaviour. The process model is implemented t o conduct a parametric study to observe the trends and characteristics of t he residual stress history varying engineer controllable input parameters. The gradients of the applied temperatures at different dwell times are iden tified as essential process parameters. An optimised curing cycle based on this observation is developed using the results of the parametric study. Th e optimal cycle achieves substantial reduction in the residual stresses and curing time for fully cured composites as compared to manufacturer recomme nded cycles. (C) 1999 Elsevier Science Ltd. All rights reserved.